The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled ...

Addressing challenges of using silicon IP, tracking IP cores, and taking advantage of the flexibility of modular design requires a proven process. It also requires a state-of-the-art IP management ...

Challenges and options vary widely depending on markets, workloads, and economics.

High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI ...

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...

UCIe helps test through a fixed shoreline, multiple redundant lanes, and mission mode lane performance monitoring.

A discussion with Jay Vleeschhouwer of Griffin Securities on EDA's continued consolidation, expansion into engineering ...

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be ...

Factors that impact mask lifetime, the future role of actinic inspection, and minimum mask dimensions for high-NA EUV.

Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and ...

Before generative AI burst onto the scene, no one predicted how much energy would be needed to power AI systems. Those ...

Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, ...